Research departments

Chemical etching


Chemical etching

Bulk or thin film materials are wet-etched in ambient or thermostated baths. A large choice of etchants is available and enables to perform more or less selective etching. These etchants are acid and basic chemical solutions which concentrations are well-defined for the required application. Standard etchings for microsystem applications concerned in particular silicon and silica.

Paillasse d'usinage humide (KOH   BHF) (CTMN)




Wet etching bench (KOH BHF)

Paillasse de Si poreux






Porous Si bench

Paillasse d'électroformage (Ni-Cu-Au)







Electroforming bench (Ni-Cu-Au)