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Chemical etching

Chemical etching

Bulk or thin film materials are wet-etched in ambient or thermostated baths. A large choice of etchants is available and enables to perform more or less selective etching. These etchants are acid and basic chemical solutions which concentrations are well-defined for the required application. Standard etchings for microsystem applications concerned in particular silicon and silica.

Paillasse d'usinage humide (KOH + BHF) (CTMN)




Wet etching bench (KOH BHF)

Paillasse de Si poreux






Porous Si bench

Paillasse d'électroformage (Ni-Cu-Au)







Electroforming bench (Ni-Cu-Au)





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