FEMTO-ST-Franche Comté Electronique Mécanique Thermique et Optique - Sciences et Technologies
Video de présentationFrom basic research to industrial partnership
Photolithography
Photolithography
Optical mask generator, HEIDELBERG DWL200
Description :
The optical mask generator is a precise laser-based system used for writing photomasks. It enables to fabricate 4 and 5 inch Chromium/Glass optical masks and has also the capability to define microstructures directly on 3 to 6 inch wafers. The maximum resolutions are 0.9µm for the 4mm writing head and 1.8µm for the 10mm one.
Coating machines
Description :
For the photolithography activities, photoresists have to be coated on substrates. To do so, two methods are available in FEMTO-ST Institute: by spin-coating (RC-8, KarlSüss) or by spray-coating for high topography surfaces (Altaspray, Süss Microtec).
RC-8 KARLSUSS spin-coater
Characteristics: maximum substrate size: 4 inch, programming: up to 9 programs, velocity: 10 to 5000rpm, acceleration: 100 to 5000rpm/sec, coating time: 1 to 999 seconds.
Aligners
Description :
Alignment system description: these machines enable to expose a photoresist-coated substrate through a mask. After development, we can obtain either the mask or its negative pattern if the resist is negative. The mask can also be aligned with pre-existent patterns on the substrate in order to work on different levels. The ultraviolet radiation is produced by a mercury lamp whose three main lines are 365nm (i-line), 405nm (h-line) and 436nm (g-line).
At FEMTO-ST, two double-face alignment systems easily align a mask with the upper face of the substrate or with the opposite one. Another way is to treat both faces at the same time. Both systems are fitted with a vacuum chamber to make a better mask/substrate contact.
Double-side EVG 620 alignment system
Resists
Description:
Resists are organic compound (generally thermoplastic polymers) whose solubility is modified by UV radiations. Several resists are available according to the desired process.
⇒ 
