Research departments

DC sputtering: PLASSYS


DC sputtering: PLASSYS MP 500
PULVERISATION DC : PLASSYS


Contact :

Alexandru TODORAN
TEMIS Sciences Building – Office N1-21
03 81 66 66 47 (Office)
03 63 08 23 77 (Deposition Area)
alexandru.todoran@femto-st.fr


Location :

TEMIS cleanroom
Deposition Area


Principle :


This machine enables to sputter off material onto every type of insulating or conductive substrates.

Technical characteristics :

- Gas : argon
- Cathodes : three 4 inch DC magnetron sources with one reinforced magnetron adapted to nickel and one 6 inch DC magnetron source
- DC supplying : 20 mA to 2 A
- Substrate polarisations : ionic etching 20 to 250 W (RF Generator HFS 500E)
- Wafer holder : 4 samples up to 4 inch rotary and positionable
- No substrate heating
- No charge lock
- Pumping system: 2063 Alcatel backing pump and Cryo Torr 8 CTI Cryogenics secondary pump
- Sa ligne de pompage très puissante avec une pompe cryogénique permet d’atteindre 1*10-5mbar en moins de 25 minutes.

Sputtered materials :

Available targets : Al, Ti, Cr, Ni, Cu, Au, Nb, W, Pd, Pt and Mo