Research departments

Optical mask generator


Optical Mask Generator Heidelberg DWL 200
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Contact :

David RADDENZATI
TEMIS Sciences building - Office N3-33
03 63 08 23 81 (Lithography Area II)
david.raddenzati@femto-st.fr


Location :

TEMIS cleanroom
Lithography Area II


Purpose :

DWL 200 is a precise lithography laser-based system. It enables to write microstructures on silicium, glass, film or other materials as long as they are coated with a photoresist.

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Technical characteristics :

- Laser type : Helium-Cadmium
- Wavelength : 442nm
- Power : 180mW
- Lifetime : 2000 hours
- Writing heads : 4mm / 10mm
- Resolution (by head) : 0.9µm / 1.8µm
- 4 inch writing time (by head) : 240mn / 45mn
- 5 inch writing time (by head) : 360mn / 75mn
- File format : GDSII, DXF, CIF, GERBER



Masks and supports :

- 4 inch and 5 inch soda-lime glass photomasks (CIPEC), AZ1518 photoresist, 100 nm thick chromium with a low reflective layer
- 3 to 6 inch wafer coated with S1805 for direct writing



Fabrication example :

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Mask used for the fabrication of IneterDigital Transducers (IDT)