Research departments

Spray Coating


Spray Coating
High topography resist coating
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Contact :

Laurent ROBERT
TEMIS Sciences Building - Office N1-21
03 81 66 66 47 (Office)
03 63 08 23 81 (Lithography Area II)
laurent.robert@femto-st.fr


Location :

TEMIS cleanroom
Lithography Area







Principle :

A resist flow is mixed to a nitrogen flow. It is then guided thanks to a thin capillary. At the outlet of the dispense nozzle, we obtain microdroplets composed of a resist/solvent mixture. The aim is to get a matter dry enough to be insensitive to gravitation effect and surface tension. Several parameters can be modified in that case : the solvent, the resist flow, the nozzle/substrate distance, the nitrogen pressure, the chuck temperature and the dispense nozzle speed.



Technical characteristics :

- Substrate sizes : up to 4 inch, any shape
- Conformal coat : positive and negative sidewall slopes
- 2 dispense nozzles : 1 for a positive resist and 1 for a negative one
- Resist thickness : 4 µm minimum (less than 3 µm possible, but slope coating not studied)
- Scanning strategy : 4 runs ( ≈ 1 µm per run)
- Sample handling : vacuum or adhesive tape
- Process time : 5 minutes



Currently used resists :

- S 1813 : 3 to 8 µm thick
- SU-8 : 8 to 20 µm thick


Resists being studied :
AZ (4999, 9260…) resists


Achieved results :

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Positive and negative sidewall slopes coating