Scie circulaire de précision pour la découpe de puces DISCO DAD 321
DISCO DAD 321 precision dicing saw for chips cut
Characteristics:
wafer saw able to cut and to polish chips,
cut depth: 2mm (maximum), blade rotation: 5000 to 30000rpm, cut speed: 0,1 to 5mm/min, blade thickness: 30µm to 2mm, blade position accuracy: /- 2µm, type: metal blade, diamond size: 2 to 50µm, type: resinoid blade, diamond size: 2 to 100µm