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Wafer Bonding EVG machine
Wafer Bonding EVG machine
Contact :
Sylwester BARGIEL
TEMIS Sciences Building
03 81 66 63 02 (Office)
sylwester.bargiel@femto-st.fr
Location :
TEMIS Cleanroom
Wafer-bonding Area
Principle :
The wafer bonding machine enables to perform bondings between different types of materials (silicon, glass, etc.). It is fitted with a positioning system enabling an accurate placement of the wafers to be bonded.
Technical characteristics :
Possible bonding process :
• Anodic bonding Pyrex - Si
• Thermo-compression bonding by means of a intermediate layer (glass-frit, epoxy glue, gold, eutectic, etc.)
• Silicon Direct bonding (Si - Si)
Setting parameters :
• Temperature (up to 550°C)
• Force (up to 7000N)
• Voltage (up to 2000V)
• Vacuum: 10-3mbar
• 3 or 4 inch wafers
• Alignment: chuck compatible with the alignment system
Achieved results :