Precision lapping system

Precision lapping system (Logitech)

Contact :

Ludovic Gauthier-Manuel
TEMIS Sciences Building - Office N1-23
03 81 66 63 94 (Office)
03 63 08 24 36 (Lapping/Polishing room)
ludovic.gauthier-manuel@univ-fcomte.fr

Location :

TEMIS Sciences Building
Lapping/Polishing room (RC-30)

Principle :

High precision lapping and polishing machine able to process different materials (silicon, glass, PZT, lithium niobate, etc.). This system is CMP compatible (chemical-mechanical planarization).

Technical characteristics :

• Integral abrasive autofeed system
• Eccentric sweep
• Sample vaccum clamping
• PP6GT lapping and polishing jigs
• Plate diameter: 30cm
• Maximum wafer size: 4 inch
• Maximum sample thickness: 11mm
• Thickness accuracy: 2 to 3µm
• Achieved roughness: nanometer order
• Precise weight measurement (0 to 4000g)
• Analog dial gauge
• Automatic plate flatness control

Achieved results :